Magnetron sputtering coating ke mokhoa o mocha oa ho roala mouoane, ha o bapisoa le mokhoa oa pejana oa ho roala mouoane, melemo ea eona likarolong tse ngata e ea hlolla.Joaloka theknoloji e hōlileng tsebong, magnetron sputtering e sebelisitsoe mafapheng a mangata.
Molao-motheo oa Magnetron sputtering:
Orthogonal magnetic field le motlakase li eketsoa pakeng tsa sputtered target pole (cathode) le anode, 'me khase e hlokahalang ea inert (hangata Ar gas) e tlatsoa ka kamoreng e phahameng ea vacuum.Matla a khoheli a sa feleng a theha matla a khoheli a 250-350 gaus holim'a thepa e shebiloeng, 'me sebaka sa orthogonal electromagnetic se entsoe ka matla a matla a motlakase a phahameng.Tlas'a phello ea tšimo ea motlakase, Ar gas ionization ho li-ion tse ntle le li-elektronike, e lebisitsoe 'me e na le khatello e itseng e mpe, ho tloha sepheo se tsoang polong ka phello ea matla a khoheli le ho eketseha ha monyetla oa khase ea ionization, ho theha plasma e phahameng ea plasma haufi le cathode, Ar ion tlas'a ketso ea lorentz force, potlaka ho fofela sebakeng se lebisitsoeng, libomo tse phunyeletsang holim'a sepheo ka lebelo le phahameng, Liathomo tse phunyeletsoeng holim'a sepheo li latela molao-motheo oa phetoho ea matla 'me li fofa hole le sebaka seo u se batlang ka kinetic e phahameng. matla ho filimi ea deposition substrate.
Magnetron sputtering hangata e arotsoe ka mefuta e 'meli: DC sputtering le RF sputtering.Molao-motheo oa lisebelisoa tsa sputtering tsa DC o bonolo, 'me sekhahla se potlakile ha u fafatsa tšepe.Ts'ebeliso ea RF sputtering e pharalletse ho feta, ntle le lisebelisoa tse tsamaisang metsi, empa hape e fafatsa lisebelisoa tse sa sebetseng, empa hape le ho lokisoa ha li-oxide, nitrides le li-carbide le lisebelisoa tse ling.Haeba maqhubu a RF a eketseha, e fetoha microwave sputtering.Hajoale, hangata ho sebelisoa mofuta oa electron cyclotron resonance (ECR) mofuta oa microwave sputtering.
Lintho tse shebiloeng tsa Magnetron sputtering:
Metal sputtering target material, coating alloy sputtering coating material, ceramic sputtering coating material, boride ceramic sputtering target material, carbide ceramic sputtering target material, fluoride ceramic sputtering target material, nitride ceramic sputtering target, oxide ceramic target, selenide ceramic sputtering. silicide ceramic sputtering target material, sulfide ceramic sputtering target, Telluride ceramic sputtering target, tse ling tsa ceramic target, chromium-doped silicon oxide ceramic target (CR-SiO), indium phosphide target (InP), lead arsenide target (PbAs), indium arsenide target (InAs).
Nako ea poso: Aug-03-2022